JRE 0709-USB3 RF Shielded Test Enclosure
Shown with populated I/O plate for illustrative purposes.
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Enclosures

RF Shielded Test Enclosure — Benchtop — JRE 0709-USB3

Pre-configured JRE 0709 with a USB3-1 filtered SuperSpeed interface, mode-selective filtering, and 2 SMA bulkheads.

Price $1,150.00 published · no quote wall

01 Specifications

Inside dimensions
3.25" H x 6.0" W x 8.5" D (90 x 150 x 215 mm)
Outside dimensions
4.5" H x 7.25" W x 9.75" D (115 x 185 x 250 mm)
Isolation
−100dB from DC to 1GHz, −95dB to 3GHz, −85dB to 6GHz
Weight
5 lbs (2.3 kg)
Shipping Weight
6 lbs (2.7 kg)
Shipping Dimensions
13" x 10" x 9" (330mm x 255mm x 230mm)
RF Absorbing Foam Thickness
1/2" (13 mm)
RF Absorbing Foam Temp Rating
90 degrees Celsius, UL 94V-0 flammability rating
RF Feedthru
2 each of SMA female bulkheads
RF Filtered Interface
One JRE USB3-1 Filtered interface
Connector Covers
Dust cover caps with tether chains included for all RF connectors
Construction
Rugged welded aluminum
Hinge
Heavy duty stainless steel friction hinge

02 Overview

A SuperSpeed USB path should not require a larger shielded enclosure when the DUT itself is compact. The JRE 0709-USB3 combines that high-speed interface with the small 0709 shell, ready for a bench setup that has already standardized on USB3.

  • USB3-1 filtered interface carries the SuperSpeed connection through the shield wall.
  • Mode-selective filtering passes differential data unfiltered while filtering common-mode RF interference.
  • Interior measures 3.25" H x 6.0" W x 8.5" D (90 x 150 x 215 mm).
  • Isolation is -100dB from DC to 1GHz, -95dB to 3GHz, and -85dB to 6GHz.
  • 2 SMA female bulkheads provide RF feedthroughs, with tethered dust caps included.
  • 1/2" (13 mm) RF absorbing foam helps manage reflections and hot-spots near the DUT.
  • Welded aluminum construction and a stainless steel friction hinge suit repeat bench handling.

At $1,150.00, the JRE 0709-USB3 is in stock and arrives with its defining interface installed. I would use a slower-USB sibling when SuperSpeed is not part of the test instead of paying for interface capability the bench will not use. Let the fully connected footprint, rather than the device body, decide whether this compact shell is large enough.

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