RF Shielded Test Enclosure — Benchtop — JRE 0709-USB3
Pre-configured JRE 0709 with a USB3-1 filtered SuperSpeed interface, mode-selective filtering, and 2 SMA bulkheads.
01 Specifications
- Inside dimensions
- 3.25" H x 6.0" W x 8.5" D (90 x 150 x 215 mm)
- Outside dimensions
- 4.5" H x 7.25" W x 9.75" D (115 x 185 x 250 mm)
- Isolation
- −100dB from DC to 1GHz, −95dB to 3GHz, −85dB to 6GHz
- Weight
- 5 lbs (2.3 kg)
- Shipping Weight
- 6 lbs (2.7 kg)
- Shipping Dimensions
- 13" x 10" x 9" (330mm x 255mm x 230mm)
- RF Absorbing Foam Thickness
- 1/2" (13 mm)
- RF Absorbing Foam Temp Rating
- 90 degrees Celsius, UL 94V-0 flammability rating
- RF Feedthru
- 2 each of SMA female bulkheads
- RF Filtered Interface
- One JRE USB3-1 Filtered interface
- Connector Covers
- Dust cover caps with tether chains included for all RF connectors
- Construction
- Rugged welded aluminum
- Hinge
- Heavy duty stainless steel friction hinge
02 Overview
A SuperSpeed USB path should not require a larger shielded enclosure when the DUT itself is compact. The JRE 0709-USB3 combines that high-speed interface with the small 0709 shell, ready for a bench setup that has already standardized on USB3.
- USB3-1 filtered interface carries the SuperSpeed connection through the shield wall.
- Mode-selective filtering passes differential data unfiltered while filtering common-mode RF interference.
- Interior measures 3.25" H x 6.0" W x 8.5" D (90 x 150 x 215 mm).
- Isolation is -100dB from DC to 1GHz, -95dB to 3GHz, and -85dB to 6GHz.
- 2 SMA female bulkheads provide RF feedthroughs, with tethered dust caps included.
- 1/2" (13 mm) RF absorbing foam helps manage reflections and hot-spots near the DUT.
- Welded aluminum construction and a stainless steel friction hinge suit repeat bench handling.
At $1,150.00, the JRE 0709-USB3 is in stock and arrives with its defining interface installed. I would use a slower-USB sibling when SuperSpeed is not part of the test instead of paying for interface capability the bench will not use. Let the fully connected footprint, rather than the device body, decide whether this compact shell is large enough.
03 Related Enclosures
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